restaurants

IMEC shows flexible packaged-IC assemblies

Researchers at IMEC (Interuniversity Microelectronics Consortium) and at Ghent University recently demonstrated results from a 3-D integration process using highly thinned ICs with flexible packaging, materials to create fully flexible circuit assemblies. ... External Source

Power-supply modulation steps up handset-power-amp efficiency

RF-engineering company Nujira has extended the reach of its efficiency-boosting technology for power amplifiers into the handset. The company has until now focused on the infrastructure side of communications, selling its HAT (high-accuracy-tracking) ... External Source

EDA revenues show unprecedented global decline

Electronic Design Automation Consortium Chair and Mentor Graphics CEO Walden Rhines speaks exclusively with EDN on EDAC's Q4 and 2008 numbers, showing industry revenues down by almost 18% year over year for the final quarter. There were some bright spots ... External Source

EDN names winners of 19th Annual Innovation Awards

EDN has bestowed its 19th Annual Innovation Awards, honoring a diverse group of electronics engineers and the ground-breaking products they have produced. The Altera Stratix IV 40-nm FPGA design team is named Innovator of the Year. Read on for a complete ... External Source

Maxim MAX17061 WLED driver recipe calls for three flavors of DAC

The IC Insider: Unity-resistor-string, binary-weighted, and R-2R ladder DAC architectures help Maxim Integrated Products’ high-efficiency driver IC power large LCD panels that use an array of LEDs as a light source. External Source

Establishing timing correlation between tools

It is vital to a smooth IC design flow that the various tools in the flow agree in their timing analysis. External Source

Voices: Chip design in recession: a view from an ASIC consolidator

Chip design in recession: changing times, changing models, and what they might all mean for designers. External Source

Bringing giant FPGAs to a new node

Altera Corp's design team for its 40-nm Stratix IV FPGA provides an example of the huge amount of work it takes to be the first to use a new process. External Source

Design-centric yield management

GUEST OPINION: As process variations and design sensitivities interact at fine geometries, yield learning may depend not just on test coverage but on fast, accurate diagnosis of problems. External Source

IP: final straw that broke the camel's back, or opening Pandora's box?

GUEST OPINION: The future of intellectual property (IP) can be brighter with some work and support by all. External Source

 < Previous   1   2   3   4   5   6   7  8  9   10   Next > 

Related Videos

Moghul CaterersFood & Celebration : Par Excellencewww.moghulcatering.com

Official Visitor SIteEverything you need to know whenwww.visitmarshallmn.com

Free Merchandise GiveawayAre you in Need of Anything Free?www.zipforcards.com

How to BroilDelicious tasting foodwww.howtobroil.com