bus bodies

Selecting the correct process geometry and options

Most of the custom chips today, including ASICs, ASSPs (application-specific standard products), and special-purpose custom chips, have function blocks that do not require leading-edge processes. External Source

Innovating out of the downturn

GUEST OPINION: If history is any indicator, innovation, not the business cycle, will pull the semiconductor industry out of recession. But this time young, innovative companies jumping on advanced processes may play a disproportionate role. External Source

Flip-flop flap

Tales From The Cube: A USB controller in an FPGA hangs up after just a couple of seconds of operation. Simulations showed that everything was fine. External Source

Simulator speeds eye measurements

Agilent Technologies has introduced a 1 million-bit-per-minute signal-integrity channel simulator for multigigabit chip-to-chip data-link design. The channel simulator allows you to perform an interactive eye-diagram measurement from channel simulations ... External Source

IMEC shows flexible packaged-IC assemblies

Researchers at IMEC (Interuniversity Microelectronics Consortium) and at Ghent University recently demonstrated results from a 3-D integration process using highly thinned ICs with flexible packaging, materials to create fully flexible circuit assemblies. ... External Source

EDA revenues show unprecedented global decline

Electronic Design Automation Consortium Chair and Mentor Graphics CEO Walden Rhines speaks exclusively with EDN on EDAC's Q4 and 2008 numbers, showing industry revenues down by almost 18% year over year for the final quarter. There were some bright spots ... External Source

EDN names winners of 19th Annual Innovation Awards

EDN has bestowed its 19th Annual Innovation Awards, honoring a diverse group of electronics engineers and the ground-breaking products they have produced. The Altera Stratix IV 40-nm FPGA design team is named Innovator of the Year. Read on for a complete ... External Source

Maxim MAX17061 WLED driver recipe calls for three flavors of DAC

The IC Insider: Unity-resistor-string, binary-weighted, and R-2R ladder DAC architectures help Maxim Integrated Products’ high-efficiency driver IC power large LCD panels that use an array of LEDs as a light source. External Source

Establishing timing correlation between tools

It is vital to a smooth IC design flow that the various tools in the flow agree in their timing analysis. External Source

Point cooling advances for hot ICs

Engineers have for years been suggesting using thermoelectric films to cool hot ICs because the films develop a temperature difference between their surfaces when you apply a voltage across them. The problems of getting the film next to the IC, establishing ... External Source

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