ulv platform

VIA enters into strategic alliance with Chunghwa Telecom and GIGABYTE to deliver 3.5G services for ultra mobile devices

VIA Technologies has announced a strategic alliance with Chunghwa Telecom to deliver high speed 3.5G services for UMDs (Ultra Mobile Devices) powered by the VIA C7-M Ultra Mobile Platform. As a result of this alliance, business users and consumers ... EDN Asia
Communication Functions

VIA-Based TabletKiosk Enters US Market

VIA Technologies has announced that TabletKiosk has selected the VIA UMPC platform to power eo, its new Ultra Mobile PC. The eo is a breed of UMPC devices that fuse traditional PC functionality, with unprecedented mobility and connectivity. Custom tailored ... Wireless Design & Development Asia (WDD Asia)
Digital Hardware/components

Intel ECX Embedded SBC from AXIOMTEK

AXIOMTEK has launched the SBC based on the Intel Embedded Compact eXtended form factor SBC, SBC84820. The Intel ECX from factor calls for x86 architecture, CompactFlash storage devices, anti-vibration environments; and the ULV/LV CPU answered for less ... ECN Asia
Boards & Modules

VIA delivers single-chipset solution for UMPCs

VIA Technologies Inc, developer of silicon chip technologies and PC platform solutions, announced the VIA VX700 chipset to build on the success of the VIA ultra mobile platform in UMPC devices, enabling reduction of mobile form factors by up to 40%. Chinhwaun ... EDN Asia
Analog ICs / Discretes - Computers / Boards / Buses - Digital ICs - Multimedia - Peripherals - Software

China’s Netbook Market Faces Unique Challenges

China’s netbook market offers high margins that no PC or CE vendor wants to miss. However, the market is not as big as it first seems, due to a few factors, reports In-Stat. First, 3G network capacity for data access remains limited. Second, Intel wants ... ECN Asia
Computers, Peripherals & Networking Devices

AXIOMTEK’s Expandable ECX Form Factor SBC

AXIOMTEK has launched the SBC based on the Intel Embedded Compact Extended form factor SBC, SBC84820. The SBC offers developers a platform to build on with the added benefit of being able to realize faster times to market for products. This platform ... ECN Asia
Boards & Modules

VIA Technologies Launches Digital Media IGP Chipsets for Ultra Mobile Devices

VIA Technologies Inc. has launched its VIA VX800 Series of digital media IGP chipsets featuring the latest video, graphics and connectivity performance in a single chip measuring just 33x33mm. The VIA VX800 Series comprises two primary digital media ... Wireless Design & Development Asia (WDD Asia)
Integrated components - Semis/ICs/Mmics - Signal Processing

Low Power Network Appliance Platform for SOHO Apps

AXIOMTEK has introduced its generation low power network security platform, the NA-811, which is a 1U desktop form factor with four Gigabit LAN ports (PCIe transaction bus), designed for small and home office (SOHO) applications. The Model NA-811 multigigabit ... ECN Asia
Embedded Systems and Networking

WIN Enterprises Announces Dual-Core Xeon Security Platform with Modular I/O

WIN Enterprises Inc. has announced the PL-01039, a 1U rack-mount platform, modifiable to support a range of security applications, including IDS/IPS, firewall, VPN gateway, Unified Threat Management (UTM), antispam, and antivirus. The device's motherboard, ... ECN Asia
Boards & Modules

VIA Announces 1-Watt Processor Power Efficient x86 CPU

VIA Technologies has announced a 500MHz addition to the VIA Eden ultra low voltage (ULV) processor family. With a power of just 0.1 watt, the 500MHz VIA Eden ULV processor has been designed from the ground up to meet the low power requirements of a wide ... ECN Asia
Integrated Circuits & Semiconductors

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