system lsi joint venture



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system lsi joint venture


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Nakaya, Amkor and Toshiba Provide Update on System LSI Joint Venture

Nakaya Microdevices Corporation (“NMD”), Amkor Technology, Inc. (Nasdaq: AMKR) and Toshiba Corporation (TOKYO: 6502) today announced that they are continuing their negotiations of definitive agreements pursuant to the non-binding memorandum of understanding ... ECN Asia
Boards & Modules

Renesas and PSC collaborate on development of system solutions for digital consumer appliances

Renesas Technology Corp. and Powerchip Semiconductor Corp. (PSC) announced an agreement that Renesas Technology will establish an equity stake in Retronix Technologies Inc. (RTX), a wholly owned subsidiary of PSC specializing in system solutions, and ... EDN Asia

Wireless IC Market Outpaced Wireline Chip Market in 2007

Growing adoption of 3G technologies and feature-rich cell-phone chips led to a 13 percent increase in sales of cellular baseband processors in 2007, according to market analyst The Linley Group. Sales of networking chips, in contrast, declined by about ... ECN Asia
Microwave & RF Components

Toshiba, Sony, and SCEI outline new joint venture for manufacturing high-performance semiconductors

Toshiba Corporation(Toshiba), Sony Corporation(Sony) and Sony Computer Entertainment Inc. (SCEI) have signed a definitive agreement to form a new joint venture among the companies for the production of high-performance semiconductors, including products ... EDN Asia
Digital ICs - Management

AOI Selects Interra's SMPTE VC1 Analyzer

Interra Systems Inc. announced that AOI Technology Inc., developer of next generation reconfigurable system LSI for multimedia processing and a joint venture of Olympus Corporation and ITX Corporation, has decided to use its SMPTE VC1 Analyzer for analyzing ... EDN Asia
Communication Functions - Component / Hardware / Interconnect - Test & Measurement

Fujitsu, Advantest establish JV for LSI prototyping services

Fujitsu Limited and Advantest Corporation announced their agreement to establish a new joint venture, e-Shuttle Inc., to provide prototyping services for integrated circuit (LSI) semiconductors. e-Shuttle will use electron beam direct lithography technology ... EDN Asia
Analog ICs / Discretes - Communication Functions - Digital ICs - Software

Wireless IC Market Outpaced Wireline Chip Market in 2007

Growing adoption of 3G technologies and feature-rich cell-phone chips led to a 13 percent increase in sales of cellular baseband processors in 2007, according to market analyst The Linley Group. Sales of networking chips, in contrast, declined by about ... Wireless Design & Development Asia (WDD Asia)
Components - Integrated components - Semis/ICs/Mmics - Signal Processing

Sony Group Expands High-Performance Semiconductors Manufacturing Alliances with IBM and Toshiba

Sony Corporation and Sony Computer Entertainment Inc. (Sony Group) announced two new and separate partnership agreements with the goal of enhancing the capabilities of Sony Group’s PlayStation business. IBM and Sony have signed an agreement to extend ... Electronics Manufacturing Asia (EM Asia)
Microelectronics/ Components - Supply Chain /Business

Regional Update

ASIC DESIGN CENTER OPENS IN SINGAPORE To better service ASIC designers in Singapore, Toshiba Electronics Asia Ltd, a subsidiary of Japan’s Toshiba Corp, has opened a design center. The facility is staffed by three engineers and contains a workstation ... EDN Asia

Fujitsu Global Mobile Platform Commences Operations

Fujitsu Global Mobile Platform Inc. (FMPI), a joint venture established based on a memorandum of understanding (MOU) tied between Fujitsu Ltd's former LSI business divisions (currently a separate entity, Fujitsu Microelectronics Ltd, "FML") and Taiwan's ... Wireless Design & Development Asia (WDD Asia)
Components - Digital Hardware/components - Integrated components - Integrated subsystems




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