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Amkor to Commence Wafer Bumping in Singapore
Amkor Technology has announced that it is establishing wafer bumping operations in Singapore using the same processes currently employed by Amkor's Unitive subsidiary in Taiwan. Amkor's Singapore bump facility is expected to commence operations in the... EDN AsiaSemiconductors
Amkor and UTAC enter into cross-license agreement
Amkor Technology and United Test and Assembly Center have entered into a multi-year cross-licensing agreement under which Amkor will license its MicroLeadFrame patents to UTAC, and UTAC will license its QFN patents to Amkor. The agreement covers the license... EDN AsiaDigital Den
Amkor PoPs Cork for Fast Growing Package on Package Solution
Amkor Technology Inc. has emerged as the semiconductor industry's leading supplier of PoP (Package on Package) solutions for cell phones and other handheld multimedia applications. Since its introduction at the end of 2004, Amkor's award winning package... EDN AsiaAmkor Repays $300 Million Second Lien Term Loan
Amkor Technology Inc.'s subsidiary Amkor Technology Korea Inc. received approval from the Bank of Korea with respect to its $300 million 7-year secured credit facility with Woori Bank . The proceeds of this loan have been drawn and were used to refinance... EDN AsiaSemiconductors
Amkor Develops Next Generation Package on Package Technology
Amkor Technology Inc. is introducing its next generation package on package (PoP) platform at the ongoing IMAPS Device Packaging Conference this week, March 9 to 12, in Scottsdale, Arizona. This new PoP platform uses Amkor’s proprietary through mold via... EDN AsiaDigital ICs - Analog ICs / Discretes - Digital Den - Embedded Development Tools - Semiconductors
Amkor Refinances $300 Million Term Loan
Amkor Technology Inc.'s wholly owned Korean subsidiary, Amkor Technology Korea Inc., has entered into a $300 million, seven-year secured credit facility with Woori Bank, a member of Woori Financial Group, one of the largest financial institutions in Korea.... EDN AsiaFinance/Economics - Semiconductors
Amkor Recognized for Excellence by Texas Instruments
Amkor Technology Inc.'s Taiwan-based operations has been presented with a Texas Instruments 2006 Supplier Excellence Award for its role in supporting the manufacture of TI DLP products. The award, given annually, honors firms whose dedication and... EDN AsiaSupply Chain
GEM Licenses Amkor's MLF Technology
Amkor Technology Inc. and GEM Services Inc. have signed a broad, multi-year patent license agreement that allows GEM to practice under Amkor's portfolio of MicroLeadFrame patents, the companies said Wednesday. GEM is an assembly and test subcon specializing... ECN AsiaDigital Den
Amkor to bump wafers in Singapore
Amkor Technology has announced that it is building a wafer bumping plant in Singapore using the same processes currently employed by the company’s Unitive subsidiary in Taiwan. Amkor expects to commence operation at the Singapore facility in the second... EDN AsiaDigital Den
GEM Licenses Amkor's MLF Technology
Amkor Technology Inc. and GEM Services Inc. have signed a broad, multi-year patent license agreement that allows GEM to practice under Amkor's portfolio of MicroLeadFrame patents, the companies said. GEM is an assembly and test subcon specializing... EDN AsiaPower Sources / Controllers
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