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Amkor to Commence Wafer Bumping in Singapore

Amkor Technology has announced that it is establishing wafer bumping operations in Singapore using the same processes currently employed by Amkor's Unitive subsidiary in Taiwan. Amkor's Singapore bump facility is expected to commence operations in the... EDN Asia
Semiconductors

Amkor and UTAC enter into cross-license agreement

Amkor Technology and United Test and Assembly Center have entered into a multi-year cross-licensing agreement under which Amkor will license its MicroLeadFrame patents to UTAC, and UTAC will license its QFN patents to Amkor. The agreement covers the license... EDN Asia
Digital Den

Amkor PoPs Cork for Fast Growing Package on Package Solution

Amkor Technology Inc. has emerged as the semiconductor industry's leading supplier of PoP (Package on Package) solutions for cell phones and other handheld multimedia applications. Since its introduction at the end of 2004, Amkor's award winning package... EDN Asia

Amkor Repays $300 Million Second Lien Term Loan

Amkor Technology Inc.'s subsidiary Amkor Technology Korea Inc. received approval from the Bank of Korea with respect to its $300 million 7-year secured credit facility with Woori Bank . The proceeds of this loan have been drawn and were used to refinance... EDN Asia
Semiconductors

Amkor Develops Next Generation Package on Package Technology

Amkor Technology Inc. is introducing its next generation package on package (PoP) platform at the ongoing IMAPS Device Packaging Conference this week, March 9 to 12, in Scottsdale, Arizona. This new PoP platform uses Amkor’s proprietary through mold via... EDN Asia
Digital ICs - Analog ICs / Discretes - Digital Den - Embedded Development Tools - Semiconductors

Amkor Refinances $300 Million Term Loan

Amkor Technology Inc.'s wholly owned Korean subsidiary, Amkor Technology Korea Inc., has entered into a $300 million, seven-year secured credit facility with Woori Bank, a member of Woori Financial Group, one of the largest financial institutions in Korea.... EDN Asia
Finance/Economics - Semiconductors

Amkor Recognized for Excellence by Texas Instruments

Amkor Technology Inc.'s Taiwan-based operations has been presented with a Texas Instruments 2006 Supplier Excellence Award for its role in supporting the manufacture of TI DLP products. The award, given annually, honors firms whose dedication and... EDN Asia
Supply Chain

GEM Licenses Amkor's MLF Technology

Amkor Technology Inc. and GEM Services Inc. have signed a broad, multi-year patent license agreement that allows GEM to practice under Amkor's portfolio of MicroLeadFrame patents, the companies said Wednesday. GEM is an assembly and test subcon specializing... ECN Asia
Digital Den

Amkor to bump wafers in Singapore

Amkor Technology has announced that it is building a wafer bumping plant in Singapore using the same processes currently employed by the company’s Unitive subsidiary in Taiwan. Amkor expects to commence operation at the Singapore facility in the second... EDN Asia
Digital Den

GEM Licenses Amkor's MLF Technology

Amkor Technology Inc. and GEM Services Inc. have signed a broad, multi-year patent license agreement that allows GEM to practice under Amkor's portfolio of MicroLeadFrame patents, the companies said. GEM is an assembly and test subcon specializing... EDN Asia
Power Sources / Controllers




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