28nm



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28nm


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Fujitsu Microelectronics and TSMC to Collaborate on 28nm Process Technology

28nm process technology targeted for foundry production of Fujitsu Microelectronics' 28nm logic ICs and to jointly develop an enhanced 28nm high-performance process technology by utilizing TSMC's advanced technology platform. Previously, both companies... EDN Asia
Analog ICs / Discretes - Digital Den - Digital ICs - DSP - EDA Tools and IP Cores - Embedded Development Tools - Processors & Tools

IBM Technology Alliance Announces Advanced 28nm Low-power Semiconductor Technology

28nm, high-k metal gate (HKMG), low-power bulk complementary metal oxide semiconductor (CMOS) process technology. The low-power, 28nm technology platform can provide power-performance and time-to-market advantages for producers of a broad range of power-sensitive... EDN Asia
Processors & Tools - Semiconductors

GLOBALFOUNDRIES, ARM Unveil SoC Platform Technology for Next-gen Mobile Applications

28nm super low power (SLP) for mobile and consumer applications and 28nm high performance (HP) for applications requiring maximum performance. “The success of the next generation of mobile products will be increasingly dependent on their ability to... EDN Asia
Communication Functions - Processors & Tools

ARM, Globalfoundries to Collaborate on 28nm HKMG Process

ARM and GLOBALFOUNDRIES have signed a broad agreement on processor implementation and circuit optimization to provide mutual customers with a robust enablement program geared towards next-generation applications. The SoC enablement program, built around ... ECN Asia
Integrated Circuits & Semiconductors

TSMC Extends Design Methodology Leadership to 28nm With Reference Flow 10.0

...rm. The newest generation of the company's reference flow continues the tradition of driving advances in design methodology, addresses new design challenges of 28nm process technology and delivers innovations to enable System-in-Package (SiP) design. ECN Asia
Integrated Circuits & Semiconductors

Foundry industry’s ‘first’ 28nm SRAM chips

28nm SRAM chips. The chips are based on UMC’s independently developed low-leakage (LL) process technology. The Company utilized advanced double-patterning immersion lithography and strained silicon technology to produce the chips, which feature very small... ECN Asia

Foundry industry’s ‘first’ 28nm SRAM chips

28nm SRAM chips. The chips are based on UMC’s independently developed low-leakage (LL) process technology. The Company utilized advanced double-patterning immersion lithography and strained silicon technology to produce the chips, which feature very small... ECN Asia
Integrated Circuits & Semiconductors

ARM, Synopsys Team with Common Platform Alliance for 32nm/28nm Mobile SOC Designs

28nm low-power/low-leakage, HKMG (high-k metal-gate) synchronized foundry services through the Common Platform manufacturing alliance of IBM, Chartered, and Samsung; and the Synopsys Lynx Design System, including Galaxy Implementation Platform for SOC... EDN Asia
EDA Tools and IP Cores - Processors & Tools

Synopsys and TSMC Deliver Accurate Lithography Verification for 28nm Designs

28nm and below. Through this joint effort, designers will now have access to the same technology that is in production at TSMC. The solution offers a 28nm lithography process checking (LPC) engine, which includes Synopsys Proteus mask synthesis technology... EDN Asia
EDA Tools and IP Cores - Processors & Tools - EDA

NEC Electronics, Toshiba Extend Chip Technology Development Agreements with IBM

28nm, high-k metal gate (HKMG) low-power chip technology geared for consumer products. NEC Electronics and Toshiba join the IBM technology alliance to develop a 28nm bulk complementary metal oxide semiconductor (CMOS) process technology. The alliance,... EDN Asia
Analog ICs / Discretes - Digital Den - Digital ICs - Semiconductors





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